My research focuses on engineering robust, scalable assembly and packaging methodologies for integrated photonic and electronic systems. This includes precision chip-to-chip edge coupling, controlled adhesive and flip-chip bonding processes, and design strategies for thermal and mechanical stability. The work spans hybrid photonic integration technologies to hermetic packaging solutions for high-reliability applications such as active medical implants and industrial gas sensors, combining experimental process development, dimensional stability analysis, and system-level validation to enable next-generation deployable integrated devices.